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Company

History

HISTORY

2022
  • Patent registration(Patent No.10-2381390, Spindle device with buffer structure)/li>
2021
  • Factory expansion and relocation(Gimpo Hakwoon 6 Industrial Complex)
  • Developed semiconductor wafer polishing spindle Cup wheel 200Ø
  • Developed deburring spindle 80Ø, 2.4KW, 30,000RPM
2017
  • Perform national task(2 things)
  • Development of spindle for internal grinding
    120Ø, 10kw, 30,000rpm / 100Ø, 10kw, 60,000rpm / 120Ø, 6kw, 60,000rpm
  • Development of spindles for CNC high speed processing machine
    80Ø, 60,000rpm, ISO 10(ATC) / 80Ø, 70,000rpm, HSK E25(ATC) 80Ø, 75,000rpm, ER11 / 62Ø, 125,000rpm
  • 150Ø, 15,000RPM Development of direct spindl
2016
  • Development of work-head spindle for tool grinding
  • Development of spindle for grinding dresser 62Ø, 30,000RPM
  • Development of spindle for testing machine 110Ø, 40,000RPM, HSK E40
  • Spindle development 80Ø, 60,000RPM, SK10
  • Development of center hole type spindle 170Ø, 25KW, 12,000RPM, BT40
2015
  • Developed ultra high-speed spindle for processing semiconductor holes 62Ø, 1.4KW, 105,000RPM,ER11 (ceramic ball bearing)
  • Developed ultra high-speed spindle for grinding bores 120Ø, 11KW, 51,000RPM, straight type

2014
  • Selected for national projects (Developing core technologies to assess and improve the reliability of the power unit for new growth)
  • Invited to present a lecture at a technological seminar (recommended by KOMMA, technological lectures on the design of spindles (twice in Changwon and Gwacheon)
  • Developed spindle for grinding LCD glass 110Ø, 5.5KW, HSK C40, 12,000RPM
  • Developed spindle for automobile tests 120Ø,11kw,45,000rpm/150Ø,18kw,36,000rpm
  • Developed spindle for grinding bores 100Ø, 4kw, 60,000rpm/120Ø,11kw,51,000rpm
  • Developed spindle for machine tools 170Ø,25kw,24,000rpm,BT40
  • Developed heavy-industry type spindle 80Ø,3.3kw,30,000rpm,straight
2013
  • Developed synchronous motor spindle for processing aircraft parts
    120Ø,HSK40,24,000RPM(option : encoder+ rotary joint)
  • Developed air bearing spindle
    62Ø,ER11,125,000RPM
2012
  • Developed spindle for machine tools 230Ø,HSK63 / 110Ø,BBT30 / 100Ø, HSK40
  • Developed spindle for grinding LCD glass
  • Developed spindle for grinding bores 90Ø, 2.5KW, 50,000RPM(option:oil-air)
  • Factor newly constructed and moved
  • Registered as venture company
  • Registered design for tool gripper
2011
  • Obtained patents (four patents)
    - Patent No. 10-1081891(Rotary Joint) - Patent No. 10-1081893(Rotary Joint)
    - Patent No. 10-1090953(Spindle device) - Patent No. 10-1131386(Rotary Joint)
  • Established a dedicated department for research and development
  • Obtained ISO 9001 certificate
  • Developed spindle for grinding LCD glass 60Ø, special taper, 40,000rpm
  • Developed high-speed rotary joint max 35,000rpm
  • Developed spindle for teeth processing 62Ø, PC6, 60,000rpm
2010
  • Developed spindle for grinding LCD glass
    80Ø, special taper, 12,000rem - 80Ø, straight, 30,000rpm
    - 110Ø, special taper, 12,000rem
2009
  • Developed spindle for grinding automotive glass 100Ø, ISO40, 12,000rpm
  • Developed spindle for machine tools HSK 63 / HSK 50 / BT 30
  • Developed spindle for grinding cylinders (bores) 90Ø,MT2, 30,000rpm
2008
  • Company name changed to Samwoo Hitech (designing and manufacturing spindles)
  • Developed spindle for engraving machines BT15 / ER16 / ISO20 / HSK E25 / HSK E30
  • Developed spindle for machines tools 120Ø,BT30, 24,000rpm -140Ø,HSK E40, 24,000rpm
1999
  • Samwoo Precisions established (processing machine parts)