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SW195A-4045-SF

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99277cec8e40db3d3df2740869c56255_1688112543_7274.png


SW195A-4045-SF

Special spindles
[Spindles for polishing semiconductor wafers]

Spindles for semiconductor equipment manufactured by SAMWOO are currently used in two fields.

A spindle for quartz processing to process quartz , a semiconductor wafer material, and a spindle for wafer polishing to precisely polish processed wafers. The spindle for quartz processing uses a ball bearing with high rigidity to enhance machinability, and the spindle for polishing uses an air bearing to enhance precision.

In addition, we are custom-manufacturing various and special spindles for semiconductors.

Specification
Housing diameter(Ø) 195
Housing material Stainless steel
Rated power(S1)kw 4.5
Max speed(rpm) 4,000
Max frequency(Hz) 134
Rated torque(Nm) 17.4
Rated current(A) 16
Motor poles 4
Tool change manual
Tool interface straight
option Flange
Cooling system water / oil
Bearing lubrication Air bush
Weight(kg) 확인
Cup wheel(Ø) 280
Power & Torque Curve

99277cec8e40db3d3df2740869c56255_1688112548_8423.png

Drawing

93bcffeb946d7363e7c5510d897b3162_1689833759_9491.png


  • 9

    Deburring spindles

    Spindle outer diameter
    Ø80
    Power(kw)
    2.4
    Torque(Nm)
    0.78
    Speed(rpm)
    30,000
    Tool interface
    SK10

    View +

  • 8

    Deburring spindles

    Spindle outer diameter
    Ø80
    Power(kw)
    2.4
    Torque(Nm)
    0.78
    Speed(rpm)
    30,000
    Tool interface
    ER11M

    View +

  • 7

    Spindles for quartz processin

    Spindle outer diameter
    Ø110
    Power(kw)
    7
    Torque(Nm)
    5.8
    Speed(rpm)
    24,000
    Tool interface
    straight

    View +

  • 6

    Spindles for tool grinding

    Spindle outer diameter
    Ø120
    Power(kw)
    1.4
    Torque(Nm)
    1.7
    Speed(rpm)
    8,000
    Tool interface
    straight

    View +

  • 5

    Spindles for testing machine

    Spindle outer diameter
    Ø150
    Power(kw)
    18
    Torque(Nm)
    7.27
    Speed(rpm)
    36,000
    Tool interface
    straight

    View +

  • 4

    Spindles for polishing semiconductor wafers

    Spindle outer diameter
    Ø150
    Power(kw)
    2.5
    Torque(Nm)
    4.1
    Speed(rpm)
    6,000
    Tool interface
    Taper

    View +

  • 열람중

    Spindles for polishing semiconductor wafers

    Spindle outer diameter
    Ø195
    Power(kw)
    4.5
    Torque(Nm)
    17.4
    Speed(rpm)
    4,000
    Tool interface
    straight

    View +

  • 2

    Spindles for testing machine

    Spindle outer diameter
    Ø170
    Power(kw)
    25
    Torque(Nm)
    16.1
    Speed(rpm)
    30,000
    Tool interface
    straight(outer Ø30)

    View +

  • 1

    Spindles for tool grinding

    Spindle outer diameter
    Ø180
    Power(kw)
    8.5
    Torque(Nm)
    14.1
    Speed(rpm)
    6,000
    Tool interface
    straight

    View +

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