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SW150A-6025-T

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99277cec8e40db3d3df2740869c56255_1688112008_762.png


SW150A-6025-T

Special spindles [Spindles for polishing semiconductor wafers]

Spindles for semiconductor equipment manufactured by SAMWOO are currently used in two fields.

A spindle for quartz processing to process quartz , a semiconductor wafer material, and a spindle for wafer polishing to precisely polish processed wafers. The spindle for quartz processing uses a ball bearing with high rigidity to enhance machinability, and the spindle for polishing uses an air bearing to enhance precision.

In addition, we are custom-manufacturing various and special spindles for semiconductors.

Specification
Housing diameter(Ø) 150
Housing material Stainless steel
Power(S1)kw 2.5
Max speed(rpm) 6,000
Max frequency(Hz) 200
Torque(Nm) 4.1
Current(A) 9.2
Motor poles 4
Tool change manual
Tool interface Taper
option ×
Cooling system water / oil
Bearing lubrication Air 
Weight(kg) 45
Cup wheel(Ø) 116
Power & Torque Curve

99277cec8e40db3d3df2740869c56255_1688112014_7291.png

Drawing

99277cec8e40db3d3df2740869c56255_1688112019_3441.png

  • 9

    Deburring spindles

    Spindle outer diameter
    Ø80
    Power(kw)
    2.4
    Torque(Nm)
    0.78
    Speed(rpm)
    30,000
    Tool interface
    SK10

    View +

  • 8

    Deburring spindles

    Spindle outer diameter
    Ø80
    Power(kw)
    2.4
    Torque(Nm)
    0.78
    Speed(rpm)
    30,000
    Tool interface
    ER11M

    View +

  • 7

    Spindles for quartz processin

    Spindle outer diameter
    Ø110
    Power(kw)
    7
    Torque(Nm)
    5.8
    Speed(rpm)
    24,000
    Tool interface
    straight

    View +

  • 6

    Spindles for tool grinding

    Spindle outer diameter
    Ø120
    Power(kw)
    1.4
    Torque(Nm)
    1.7
    Speed(rpm)
    8,000
    Tool interface
    straight

    View +

  • 5

    Spindles for testing machine

    Spindle outer diameter
    Ø150
    Power(kw)
    18
    Torque(Nm)
    7.27
    Speed(rpm)
    36,000
    Tool interface
    straight

    View +

  • 열람중

    Spindles for polishing semiconductor wafers

    Spindle outer diameter
    Ø150
    Power(kw)
    2.5
    Torque(Nm)
    4.1
    Speed(rpm)
    6,000
    Tool interface
    Taper

    View +

  • 3

    Spindles for polishing semiconductor wafers

    Spindle outer diameter
    Ø195
    Power(kw)
    4.5
    Torque(Nm)
    17.4
    Speed(rpm)
    4,000
    Tool interface
    straight

    View +

  • 2

    Spindles for testing machine

    Spindle outer diameter
    Ø170
    Power(kw)
    25
    Torque(Nm)
    16.1
    Speed(rpm)
    30,000
    Tool interface
    straight(outer Ø30)

    View +

  • 1

    Spindles for tool grinding

    Spindle outer diameter
    Ø180
    Power(kw)
    8.5
    Torque(Nm)
    14.1
    Speed(rpm)
    6,000
    Tool interface
    straight

    View +

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